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. Plating and lithography techniques can be used during front end manufacture to build bump and pillar structures. In addition, solder balls may also be placed or printed and then reflowed during back end manufacture before wafer dicing
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stress reduction following wafer thinning and/or dicing. In the medical device industry plasma treatment can solve challenges due to issues with bio-compatibility, material mismatch, implant duration, ability to withstand sterilization, wettability, lubricity, and such
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