Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. Klein Wassink, Soldering in Electronics, A Comprehensive Treatise on Soldering Technology for Surface Mounting and Through-Hole Techniques, 2nd Edition, Electrochemical Publications, Great Britain, 310- 311, 1984. [3] Raiyo F. Aspandiar, “Voids in Solder
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Klein Wassink, Soldering in Electronics, A Comprehensive Treatise on Soldering Technology for Surface Mounting and Through-Hole Techniques, 2nd Edition, Electrochemical Publications, Great Britain, 310- 311, 1984. [3] Raiyo F. Aspandiar, “Voids in Solder
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. Klein Wassink, Soldering in Electronics, A Comprehensive Treatise on Soldering Technology for Surface Mounting and Through-Hole Techniques, 2nd Edition, Electrochemical Publications, Great Britain, 310- 311, 1984. [3] Raiyo F. Aspandiar, “Voids in Solder
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
like to thank the Coralville Common Process group for test vehicle assembly and Ken Blazek, AOE, for metallurgical cross-sectional tasks. REFERENCES 1. R.J.K. Wassink, Soldering in Electronics, Electrochemical Publications, Great Britain, 1989, pp. 472
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
like to thank the Coralville Common Process group for test vehicle assembly and Ken Blazek, AOE, for metallurgical cross-sectional tasks. REFERENCES 1. R.J.K. Wassink, Soldering in Electronics, Electrochemical Publications, Great Britain, 1989, pp. 472
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