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. Profiling Higher melting points shrink the process window dramatically. Eutectic tin/lead solder has a melting point of 183°C with a full liquidus temperature of 205° to 215
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. Users are quickly and intuitively guided through profiling, and a Process Window Index™ (PWI) lets operators know at a glance how “in spec” a given profile is—the lower the PWI number, the more centered the profile is within the process window
| http://etasmt.com/te_news_bulletin/2021-09-02/24963.chtml
. Profiling Higher melting points shrink the process window dramatically. Eutectic tin/lead solder has a melting point of 183°C with a full liquidus temperature of 205° to 215
