ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/products/electronics-solutions-products/select-fx-942-automated-solder-inspection
. The FX-942 is highly effective for selective soldering, post wave soldering, SMT and connector inspection. Integrated Solution
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5101
Moisture Effects in Common Solderable RF Connector Dielectrics Part II: Characterization of Damage Threshold Moisture Level for Moisture/Reflow Sensitive Polymers 中文
| https://www.eptac.com/faqs/ask-helena-leo/ask/what-is-the-correct-way-to-fill-solder-cups
] or more of gold thickness A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
] or more of gold thickness A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.eptac.com/solder-tips/
. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
| https://www.eptac.com/faqs/ask-helena-leo/ask/excess-flux-causing-intermittent-connection-issues
. Can you comment on this? Answer: We have to find out how where the additional flux is being added. Is it coming from a spray flux application, like a wave solder operation
| https://www.eptac.com/soldertip/gold-removal-issues-with-hollow-cup-connectors/
: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
| http://etasmt.com:9060/te_news_industry/2021-08-31/23961.chtml
.050" SEARAY™ High Speed High Density Open Pin Field Array, has up to 500 I/O contact pins with a solder charge termination. This type of connector looks like a standard BGA type of SMT device
| http://etasmt.com/te_news_industry/2021-08-31/23961.chtml
.050" SEARAY™ High Speed High Density Open Pin Field Array, has up to 500 I/O contact pins with a solder charge termination. This type of connector looks like a standard BGA type of SMT device
