PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post10645.html
0.17 nominal ball diameter. My question is what would be the Max - Min used for nom. balls that are not in the table for collapsing BGA. Example a
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic2607_post12477.html
0.17 nominal ball diameter. My question is what would be the Max - Min used for nom. balls that are not in the table for collapsing BGA. Example a
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post11390.html
0.17 nominal ball diameter. My question is what would be the Max - Min used for nom. balls that are not in the table for collapsing BGA. Example a
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic2607_post10649.html
0.17 nominal ball diameter. My question is what would be the Max - Min used for nom. balls that are not in the table for collapsing BGA. Example a
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/0402-min-size-land-pattern_topic30&OB=DESC_page2.html
“Nominal” environment for library construction, use the “Least” environment for the 0402 (1005) land pattern. Too much solder on this micro-miniature 2-pin component causes tombstoning in the assembly reflow oven
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/0402-min-size-land-pattern_topic30&OB=DESC_page2.html
“Nominal” environment for library construction, use the “Least” environment for the 0402 (1005) land pattern. Too much solder on this micro-miniature 2-pin component causes tombstoning in the assembly reflow oven
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic976&OB=DESC.html
. With a 3D mouse ( http://www.3dconnexion.com/products/what-is-a-3d-mouse.html ) you can maneuver around to see all the 3D mode component features, solder pad, solder mask, silkscreen and trace routing features
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic976.html
. With a 3D mouse ( http://www.3dconnexion.com/products/what-is-a-3d-mouse.html ) you can maneuver around to see all the 3D mode component features, solder pad, solder mask, silkscreen and trace routing features
| http://etasmt.com/cc?ID=te_news_bulletin,20761&url=_print
. The welding effect of a printed board must be checked. 5. Whether the soldering is sufficient, whether the surface of the solder joint is smooth, whether the solder joint shape is half-moon shape, the condition of tin balls and residue, the condition of
