Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
) • Danish Environmental Agency • Green environment = lead free / halide-free • Japanese companies driving quick implementation • Market Demand – Consumers will opt for lead free products No Lead Solder is Coming QUESTIONS
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
) • Danish Environmental Agency • Green environment = lead free / halide-free • Japanese companies driving quick implementation • Market Demand – Consumers will opt for lead free products No Lead Solder is Coming QUESTIONS
Heller Industries Inc. | https://hellerindustries.com/events/ipc-apex-expo/
Curing Applications Low Void Curing Thermal Process Solutions Reflow Soldering Solutions Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
| http://etasmt.com/te_news_bulletin/2021-08-31/23576.chtml
Reflow-related causes: • Preheat portion of profile and rate of heating too aggressive (should not exceed 4K/sec. per 20 sec. interval. Dull solder joints Dull
| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print
(from plating) and to the pad (from hot air leveling or other pcb solder-coating method), an intermetallic of tin-copper forms. This is typically Cu6Sn5 or Cu5Sn6 and this intermetallic is what causes the solder to adhere to the copper pads and leads
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4717
(bottom solder joints (SnPb paste/SAC305 solder balls) exhibited excellent TMF performance (η = 2600 ±200 cycles; Β = 7.6 ±3.5) as did the middle (η = 2500 ±300 cycles; Β = 6.6 ±3.4) and top joints (η = 2600 ±200 cycles; Β = 8.7 ±4.0). The 100% SAC305 test vehicle showed comparable
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/materials
. Low Cycle Fatigue of Individual Soldered Interconnects App Note DAGE bond testers uniquely perform cyclic shear testing on individual solder balls
| https://www.smtfactory.com/Introduction-to-the-working-principle-of-Lyra-Reflow-Oven-id45852477.html
. At the end of the heat preservation section, the oxides on the pads, solder balls and component pins are removed under the action of the flux, and the temperature of the entire circuit board is also balanced
| http://etasmt.com:9060/te_news_bulletin/2020-11-20/20761.chtml
. The welding effect of a printed board must be checked. 5. Whether the soldering is sufficient, whether the surface of the solder joint is smooth, whether the solder joint shape is half-moon shape, the condition of tin balls and residue, the condition of
