Partner Websites: what causing lifted pad (Page 1 of 4)

Library Expert 2016.10 Released!! - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1951&OB=ASC.html

: Fixed a rotation problem concerning free-floating pieces of paste mask Fixed an issue that was causing the corner radius on rounded rectangles to only be half what they should be when importing PADS files PADS

PCB Libraries, Inc.

PCB Libraries Forum : Component Placement Courtyards

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_component-placement-courtyards_topic1905.xml

·        PADS to CAD:o  Fixed an issue that was causing the cornerradius on rounded rectangles to only be half what they should be when importingPADS files·        PADS:o  

PCB Libraries, Inc.

Component Placement Courtyards - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/component-placement-courtyards_topic1905.html

   Fixed Side Concave 2, 4-Pin Oscillator for micro-miniature version ·          PADS to CAD: o    Fixed an issue that was causing the corner radius on rounded rectangles to only be half what they should be when importing PADS files ·          PADS: o

PCB Libraries, Inc.

Component Placement Courtyards - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1905&OB=ASC.html

. This mirrors what was done previously and allows it to not rely on the default precision. ·          CR-5000: o    m callouts for solder mask pads will split out properly to be used for the pad name when using IPC-7351 naming o

PCB Libraries, Inc.

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test

) Beam broken between bond and edge of silicon. (d-6) Bond lifted. (d-7) Lifted metallization (separation of metallization) from die, separation of bonding pad. (d-8

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/

) Beam broken between bond and edge of silicon. (d-6) Bond lifted. (d-7) Lifted metallization (separation of metallization) from die, separation of bonding pad. (d-8

PCB Libraries Forum : Library Expert 2016.08 Released!!

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_library-expert-2016-08-released_topic1925.xml

:Fixed an issue where terminal outlines were causing the pad stacks to build improperlyAllegro/OrCAD PCB:Fixed an issue with pads with associated copper being rotated in the wrong direction during a PADS -> CAD Conversion

PCB Libraries, Inc.

2012.43 Released! - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/2012-43-released_topic850_post3037.html

! FIXED: OrCAD PCB/Allegro – Fixed an issue with hidden pins not being filtered PADS – Fixed Thermal Pad orientation when chamfered corners were used PADS – When

PCB Libraries, Inc.

2012.43 Released! - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/2012-43-released_topic850_post3037.html

! FIXED: OrCAD PCB/Allegro – Fixed an issue with hidden pins not being filtered PADS – Fixed Thermal Pad orientation when chamfered corners were used PADS – When

PCB Libraries, Inc.

2012.43 Released! - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic850&OB=ASC.html

! FIXED: OrCAD PCB/Allegro – Fixed an issue with hidden pins not being filtered PADS – Fixed Thermal Pad orientation when chamfered corners were used PADS – When

PCB Libraries, Inc.

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