PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc7351-ipca610-side-overhang_topic3111_post12385.html
, 99.999% of the time the chip is centered on the pad during reflow and in reality there is no overhang. The standard just says what is acceptable
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc7351-ipca610-side-overhang_topic3111_post12389.html
, 99.999% of the time the chip is centered on the pad during reflow and in reality there is no overhang. The standard just says what is acceptable
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
: "Assessments of Solder Joint Interconnection and Inner Package Interconnection (Via) Qualities for Improved Understanding of Chip to Package Interaction, Using Laser Ultrasonic Inspection Technique" Where is he now
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23576.chtml
:7 Component Cracking Cracking of multilayer ceramic capacitors has been attributed to excessive heating rates during reflow. This may be somewhat mythical and what little cracking is still observed usually tends to be due to defects in the manufacturing process of the capacitor
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/thermal-interface-material-tim?con=t&page=3
-component materials for applications in electronics assembly Select Cure IR-9 Inline Oven Nordson ASYMTEK Nordson ASYMTEK’s Select Cure® IR-9 inline oven is ideal for top and bottom material curing in low- to high-volume production environments
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PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_ipc7351-smd-pth-reference-calculators_topic785.xml
. But Chip Capacitors have metal Terminals on 5 sides and a side fillet is a reality. IPC-7351 is no longer a Standard (even though the cover of IPC-7351B says so).
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/altium-0402-resistor-footprint_topic2596_post10581.html
17.1, the Altium IPC Wizard didn't follow the IPC standard for the spacing between pads on chip components. This was what I found and filed with them 3 years ago
