| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
What is the Correct Way to Fill Solder Cups - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly. Note: Gold embrittled solder connections can occur regardless of gold thickness when solder volume is low or the soldering process dwell time is not sufficient to allow the gold to dissolve throughout the
| https://www.eptac.com/soldertips/whats-with-the-expiration-dates-on-solder-paste-or-wire/
leakage and create dendritic growth on the laminate material or between component leads which will cause failures. Ok, so is there a test I can perform to determine if my solders are good enough to use
| https://www.eptac.com/webinar/tempered-leads-class-3-rework-toe-fillets-and-more/
. At the end, we will open it up for a Q&A session, so that you can ask away. Topics we will be reviewing are: Tempered Leads – What they really are
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
September, 2015 by Leo Lambert Recent Articles IoT and the Aerospace Industry – Too Risky? Leaded vs. Lead-Free Solder: Which is Better? The 5 Essential Tools for Soldering The Importance of IPC-A-610 Certification How to Build on Your Career in Soldering Categories Blog Uncategorized Why Get IPC Certified Gold and electronics have
| https://www.eptac.com/faqs/soldertips/soldertip/whats-with-the-expiration-dates-on-solder-paste-or-wire
leakage and create dendritic growth on the laminate material or between component leads which will cause failures. Ok, so is there a test I can perform to determine if my solders are good enough to use
| https://www.eptac.com/webinars/tempered-leads-class-3-rework-toe-fillets-and-more/
& Techniques for Manually Reflowing of Solder Paste DOWNLOAD PDF PRESENTATION WATCH ON DEMAND Course Length: 47 Minutes | Cost: FREE | Presenter: Leo Lambert We receive, almost on a daily basis, questions regarding production issues, standards and specification interpretation and just plain old, what is wrong with this manufacturing process
| https://www.eptac.com/webinars/tempered-leads-class-3-rework-toe-fillets-and-more
: Leo Lambert We receive, almost on a daily basis, questions regarding production issues, standards and specification interpretation and just plain old, what is wrong with this manufacturing process
Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/
). Over time, as this intermetallic layer grows thicker, it becomes the Achilles Heal of the solder joint in terms of integrity. Depending upon the stresses imposed on the assembly and the solder joints, this is what usually ultimately leads to joint cracking and failure
Heller Industries Inc. | https://hellerindustries.com/intermetallic-growth/
). Over time, as this intermetallic layer grows thicker, it becomes the Achilles Heal of the solder joint in terms of integrity. Depending upon the stresses imposed on the assembly and the solder joints, this is what usually ultimately leads to joint cracking and failure
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