Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. How does moisture absorption damage occur, and what steps can you take to eliminate it? In this blog, we cover everything you need to know about moisture-sensitive devices
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/orcad-17-2-end-layer-regular-pad-is-undefined_topic1958_post8049.html
OrCAD 17.2: END LAYER Regular Pad Is Undefined - PCB Libraries Forum - Page 1 Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login OrCAD 17.2: END LAYER Regular Pad Is Undefined
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/orcad-17-2-end-layer-regular-pad-is-undefined_topic1958_page1.html
OrCAD 17.2: END LAYER Regular Pad Is Undefined - PCB Libraries Forum - Page 1 Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login OrCAD 17.2: END LAYER Regular Pad Is Undefined
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1958&OB=ASC.html
OrCAD 17.2: END LAYER Regular Pad Is Undefined - PCB Libraries Forum - Page 1 Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login OrCAD 17.2: END LAYER Regular Pad Is Undefined
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
. For clarification, gold removal is conducted to prevent gold embrittlement in the solder joint and this embrittlement has caused many problems in the past
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/jedec-mo240-aa_topic1539_post6235.html
. Tom, Solder resist is not solder paste :) Bit IMO the same should apply to the resist as the paste, that way the thermal pad paste does not get anywhere the outer pads irrespective of whatever the copper layout it
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/jedec-mo240-aa_topic1539_post6233.html
Matthew Lamkin Report Post Thanks(0) Quote Reply Posted: 23 Jan 2015 at 8:29am What about my thoughts on the solder resist between the smaller & large pad
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/jedec-mo240-aa_topic1539_post6234.html
. Tom, Solder resist is not solder paste :) Bit IMO the same should apply to the resist as the paste, that way the thermal pad paste does not get anywhere the outer pads irrespective of whatever the copper layout it
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/jedec-mo240-aa_topic1539_post6235.html
. Tom, Solder resist is not solder paste :) Bit IMO the same should apply to the resist as the paste, that way the thermal pad paste does not get anywhere the outer pads irrespective of whatever the copper layout it
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_ipc-adoption-justification_topic1970.xml
out.Again, this does not link to a "study" but is just actual experience of using standardized pad codes that improved efficiency and saved the company money - this I think is what counts more for most employers
