| https://www.smtfactory.com/What-are-the-precautions-for-the-safe-operation-of-SAMSUNG-Pick-Place-Machine-id3726468.html
. The operator of SAMSUNG Pick & Place Machine should be careful and careful. Precautions for safe operation of SAMSUNG Pick & Place Machine. SAMSUNG Pick & Place Machineis a high-tech product
| https://www.smtfactory.com/What-is-the-LED-Display-SMT-Production-Process-id41946657.html
. SMT Production Process: What equipments are required for SMT Production Line ? SMT Stencil Printer I.C.T-4034 The solder paste is evenly spread on the PCB board
| https://www.smtfactory.com/What-are-the-usage-methods-and-precautions-of-SAMSUNG-Pick-Place-Machine-id3326468.html
What is the workflow of SAMSUNG Pick & Place Machine? How to use SAMSUNG Pick & Place Machine correctly and efficiently? What matters should users of SAMSUNG Pick
| https://www.smtfactory.com/What-are-the-factors-that-affect-the-quality-of-SAMSUNG-Pick-Place-Machine-steel-mesh-id44262477.html
& Place Machine stencil is removed from the machine or the solder paste is not printed on the printing machine for 1 hour, it should be cleaned in time
| https://www.smtfactory.com/What-is-the-working-process-of-Full-auto-SMT-Stencil-Printer-id40272477.html
Stencil Printerthen receives the next PCB to be printed. What are the production steps of Full-auto SMT Stencil Printer? Fix the stencil to the Full-auto SMT Stencil Printer and debug OK, then assemble the clean squeegee on the automatic solder paste printer
| https://www.smtfactory.com/What-is-the-application-prospect-and-development-direction-of-Lyra-Reflow-Oven-id43172477.html
What is the application prospect and development direction of Lyra Reflow Oven? - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch
| https://www.smtfactory.com/What-are-the-functions-and-uses-of-SAMSUNG-Pick-Place-Machine-id3558478.html
from the size of the currently mounted PCB, the width of the PCB positioning table of SAMSUNG Pick & Place Machine and the transfer mechanism of the PCB should be adjusted
| http://etasmt.com/te_news_bulletin/2020-05-04/15961.chtml
. If there is a BGA, the peak temperature should be set within 240 to 260 degrees and maintained for about 40 seconds. In addition, it should be noted that in the reflow area, the reflow soldering time should not be too long, so as not to cause damage to the furnace, or cause the PCB board to be scorched or the component malfunctions
| http://etasmt.com:9060/te_news_bulletin/2020-05-04/15961.chtml
. If there is a BGA, the peak temperature should be set within 240 to 260 degrees and maintained for about 40 seconds. In addition, it should be noted that in the reflow area, the reflow soldering time should not be too long, so as not to cause damage to the furnace, or cause the PCB board to be scorched or the component malfunctions
| http://etasmt.com/te_news_industry/2021-08-31/23963.chtml
. Quality engineers should also involved in order to inspect the solder joint. An x-ray inspection machine may be utilized for further analysis. Keywords: Check Our Youtube
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