ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/fluxplus-paste-flux
. WS flux residue is corrosive and should be removed as soon as possible after reflow to avoid damage to your assembly. Maximum safe time before cleaning is product dependent
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. In the absence of testing to prove otherwise, RA flux residue is assumed to be corrosive. Assemblies sensitive to corrosion or the possibility of electrical conduction through the residue should be cleaned as soon as possible after assembly
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
. In the absence of testing to prove otherwise, RA flux residue is assumed to be corrosive. Assemblies sensitive to corrosion or the possibility of electrical conduction through the residue should be cleaned as soon as possible after assembly
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
process. Reflow profiles are most commonly associated with printed circuit boards heated in reflow ovens. Residue The portion of flux that remains after solder paste has been reflowed. Rosin Activated (RA) Consists of rosin, solvent, and aggressive
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Reflow profiles are most commonly associated with printed circuit boards heated in reflow ovens. Residue The portion of flux that remains after solder paste has been reflowed. Rosin Activated (RA) Consists of rosin, solvent, and aggressive activators
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/072820-ink-marking-how-to-choose-the-right-system-for-qa-processes
. Typically, a reject mark is not needed for this type of process. Nordson EFD offers advanced solutions for ink marking applications. MicroMark® spray marking systems eliminate maintenance, clogging, and downtime by using a programmable nozzle air delay to blow residue off the spray nozzle after each cycle
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-frequently-asked-questions
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Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
&place machine Excessive solder paste slump after printing Sphere size of solder paste too large for pitch components being soldered Excessive moisture absorbed by solder paste Solder paste exposed
Heller Industries Inc. | https://hellerindustries.com/solder-ball-defects/
&place machine Excessive solder paste slump after printing Sphere size of solder paste too large for pitch components being soldered Excessive moisture absorbed by solder paste Solder paste exposed
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects
&place machine Excessive solder paste slump after printing Sphere size of solder paste too large for pitch components being soldered Excessive moisture absorbed by solder paste Solder paste exposed
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