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… Ribbon peel Nordson DAGE The wide variety of ribbon sizes, loop heights and spans calls for flexibility in bond test methodology which is catered for with the Nordson DAGE bondtesters
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learn more about Nordson DAGE's X-ray and AOI systems = Stand E110 IMAPS 2019 Nordson DAGE Visit us in Booth #210 to learn about the latest developments in Bond and Materials Testing including the new Prospector™
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?con=t&page=34
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) Wafer X-ray Metrology (2) X-ray Counting Systems (2) Software (1) Test Types Ball Shear Solder Ball Shear (9) Bump Shear (9) Cavity Shear (9) Cold Bump Pull (9) Die Shear (7) Wire Pull (7) Wafer (6) First Bond Ball Pull Stud Bump Pull
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) Wafer X-ray Metrology (2) X-ray Counting Systems (2) Software (1) Test Types Ball Shear Solder Ball Shear (9) Bump Shear (9) Cavity Shear (9) Cold Bump Pull (9) Die Shear (7) Wire Pull (7) Wafer (6) First Bond Ball Pull Stud Bump Pull
