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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-white-paper-plasma-clean-to-reduce-wire-bond-failures-now-available
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1016-voids-and-bond-defects
. Result Red areas are large voids in the underfill. In addition, the area of bond of the solder balls (white) is in many instances incomplete, indicating that these solder balls are only partially bonded
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/wire-pull
Contact Global HQ Africa Asia Central and South America Europe USA and Canada Nordson DAGE Home Test Types Wire pull Wire pull The principle behind basic wire bond testing is positioning of a hook
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