Partner Websites: wire bonding gold (Page 12 of 88)

Literature Library | Nordson MARCH

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Gold-Plated Copper Leadframe Interface Nordson MARCH Using Argon Plasma to Remove Fluorine, Organic and Metal Oxide Contamination for Improved Wire Bonding Performance Nordson MARCH Technology Drivers

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Ask Questions | EPTAC

| https://www.eptac.com/ask/

Question: Are there any references or materials I can look at or download specific to Lead-Free Soldering? Read Answer Gold Wire Bond Failing Pull Test Question: We have a situation where we have gold boards which accept gold wire bonding, but are failing a

Literature Library | Nordson MARCH

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/support/literature-library?fb=1197fa6e9bdf4ed5b55aaf07c9df8123&div=bb08ae6983b64e9fb5da35878f14ced1&kw=TRAK%2BAutomated%2BSeries&qs=t&page=1

and Metal Oxide Contamination for Improved Wire Bonding Performance Nordson MARCH Bonding Strengths at Plastic Encapsulent−Gold-Plated Copper Leadframe Interface Nordson MARCH Technology Drivers for Plasma Prior to Wire Bonding Nordson MARCH Working Around the Fluorine Factor in Wire Bond Reliability Nordson MARCH Plasma

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Medical, Life Science and Pharmaceutical | Nordson MARCH

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Insulated Bonding Wire Technology Nordson MARCH Cleaning and Coating Workshop Nordson MARCH Free Workshop in Philadelphia: Five Critical Steps to Conformal Coating Success

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Electronics - Semiconductor Plasma Surface Treatment | Nordson MARCH

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Gold-Plated Copper Leadframe Interface Nordson MARCH Working Around the Fluorine Factor in Wire Bond Reliability Nordson MARCH Critical Plasma Processing Parameters for Improved Strength of Wire Bonds

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What is the Correct Way to Fill Solder Cups - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/what-is-the-correct-way-to-fill-solder-cups

: I noticed a lot of my techs, while soldering cups, are not putting the soldering iron on the back of the cup, filling with solder, then adding the tinned wire

What is the Correct Way to Fill Solder Cups - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/

: I noticed a lot of my techs, while soldering cups, are not putting the soldering iron on the back of the cup, filling with solder, then adding the tinned wire

Anisotropic and Isotropic Etch | Nordson MARCH Plasma Cleaning

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/process/anisotropic-and-isotropic-etch?con=t&page=10

#5743 Bonding Strengths at Plastic Encapsulent−Gold-Plated Copper Leadframe Interface Nordson MARCH Nordson MARCH White Paper, Plasma Clean to Reduce Wire Bond Failures, Now Available Online Nordson MARCH Describes wire bond failures, their causes

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