ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-offers-free-technical-consulting-services-on-plasma-treatmentat-smt-hybrid-packaging
Hybrid Packaging, Nuremberg, DAGE Deutschland Stand 6-314 2015-04-28 Plasma cleaning prior to wire bonding delivers a cleaner bonding surface, reducing device failures Concord, California, USA
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
: We have a situation where we have gold boards which accept gold wire bonding, but are failing a pull test. Other than making sure the boards are clean with a quick trip into the degreaser, is there any other way to refresh gold... Question
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
: We have a situation where we have gold boards which accept gold wire bonding, but are failing a pull test. Other than making sure the boards are clean with a quick trip into the degreaser, is there any other way to refresh gold plating to help these boards pass pull testing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/industries/construction-and-architectural/cable-manufacturing?con=t&page=12
Nordson hot and cold material dispensing or powder coating for wire and cable manufacturing Adhesive Dispensing Systems Corporate | Global Directory
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-presents-paper-smta-guadalajara-2017-foote
. Plasma treatment cleans surfaces prior to bonding to enhance adhesive bonding and wire bonds and enhances the flow of underfill materials for flip chip packages enabling better bonding and more reliable packages
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-presents-two-papers-on-plasma-cleaning
. Plasma is also beneficial for flip-chip packaging, for pretreatment prior to wire bonding, for robust and reliable bonds on advanced packages with very thin metal stacks for bonding, and for silicon
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/support/literature-library?fb=1197fa6e9bdf4ed5b55aaf07c9df8123&div=bb08ae6983b64e9fb5da35878f14ced1&kw=RIE%2BSystem&qs=t&page=2
Insulated Bonding Wire Technology Nordson MARCH Plasma Clean to Reduce Wire Bond Failures Nordson MARCH How Plasma-Enhanced Surface Modification Improves the Production of Microelectronics and
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/support/literature-library?fb=1197fa6e9bdf4ed5b55aaf07c9df8123&div=bb08ae6983b64e9fb5da35878f14ced1&kw=Plasma%2BPrior%2Bto%2BConformal%2BCoating&qs=t&page=2
SEALANT EQUIPMENT Nordson SELECT Nordson SONOSCAN Nordson YESTECH Polymer Processing Systems Search Results: 13-24 of about 25 Plasma Clean to Reduce Wire Bond Failures Nordson MARCH Surface Preparation for Improved Adhesion Nordson MARCH Using Argon Plasma to Remove Fluorine, Organic and Metal Oxide
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/support/literature-library?fb=1197fa6e9bdf4ed5b55aaf07c9df8123&div=bb08ae6983b64e9fb5da35878f14ced1&kw=PCB%2BManufacturing%2BApplications&qs=t&page=2
Insulated Bonding Wire Technology Nordson MARCH Bonding Strengths at Plastic Encapsulent−Gold-Plated Copper Leadframe Interface Nordson MARCH Plasma Clean to Reduce Wire Bond Failures Nordson MARCH Copper Wire Bonded Devices
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/process/etchback-and-desmear?con=t&page=10
: Etchback and Desmear FlexTRAK-S Plasma System - Ltr Nordson MARCH FlexTRAK-CDS Plasma System - Ltr Nordson MARCH Plasma Clean to Reduce Wire Bond Failures Nordson MARCH Using Argon Plasma to Remove
