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& Solutions Nordson produces industrial machinery designed to solve problems in an expansive set of diverse industries. View All Products Bonding
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protection for these devices. Nordson MARCH Surface Preparation Solutions Gas plasma technology can be used to plasma clean pads prior to wire bonding to improve bond strengths and yields. Poor bond strengths and low yields are often due to upstream
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. The plasma chamber is capable of processes such as oxide removal, organic contamination clean and surface activation, depending upon chamber kit and electrode configuration
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. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer