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. In many cases, X-Ray inspection (2D and 3D) provides the only non-destructive techniques to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through holes, TSVs, micro-bumps, copper pillars, etc
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/products/x-ray-inspection-systems?con=t&page=3
, einschließlich BGA-, QFN- und IGBT-Verbindung, PTH-Füllung, Grenzflächenfehler,… USA & Kanada Bondtester und X-Ray Kontakt Nordson DAGE X-ray Care X-Ray Inspection and Test Products Flexible Wartungspläne für
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Wafer X-ray Metrology | Nordson DAGE X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
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