Eclipse Industries manufactures the ultra-high precision DS-107 Aligner Bonder, alignment to 1-2 microns, bond force 5 gm to 100 kg. Applications are flip chip, die bonding, CSP, uBGA, MCM, flat panel displays, die-to-wafer & optoelectronics.
Industry Directory | Manufacturer
Swiftmode's Brand New Website went live 28th February 2020. The new site is so easy to navigate and find the information you want. You will learn about Swiftmode's longevity as a stable company.
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