Industry Directory | Manufacturer
Micralyne offers a patented process for electroplating AuSn solder alloy, at compositions from 10 to 40 Sn (wt%), in patterned or unpatterned shapes onto metallized substrates at virtually any thickness.
Industry Directory | Manufacturer
We are manufacturer of key products for semiconductor back end process and interconnect materials. Our main products:solder balls, Bonding wire (Au, Ag, Cu, Pd-Cu),sputtering target & EVM materials.
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