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2 bga corner results

Industry Directory: bga corner (Page 1 of 1)

Tianjin Reains Technologies Co., Ltd

Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.

ALLTEMATED, INC.

Industry Directory | Manufacturer

Alltemated sets the standard for tape and reel packaging, IC programming, lead trim/forming, bake and dry-pack services and carrier tape manufacturing.

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