Heat-activated, anti-static cover tapes for component packaging offer superior bond performance, resistivity and adhesive integrity. WAFERTAPE products for wafer mounting, dicing and backgrinding insure consistent, precise, repeatable wafer yields.
Industry Directory | Manufacturer
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.
Industry Directory | Manufacturer
Sikama International designs, develops, manufactures and markets reflow solder furnaces/curing systems, featuring our patented conduction+convection heating and cooling technology. Our furnaces are designed for efficient use of power and gas.
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
| 1 |
