Suppliers Of Microelectronics & PCB Assembly Equipment & Materials, including die bond, wire bond & test & SMT screen printers & pick and place systems.
Industry Directory | Manufacturer
Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.
Industry Directory | Consultant / Service Provider / Manufacturer
Micro Hybrids offers true solutions for your hybrid micro circuit design, layout, production, testing and quality control needs.
Industry Directory | Manufacturer
Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.
Industry Directory | Manufacturer
MPIQC is an Electronic Manufacturing Services (EMS) company. Our services are provided at the highest standards to be recognized as a global leader in OEM optimization in IPC Class 2 & Class 3 manufacturing.
Industry Directory | Consultant / Service Provider / Manufacturer
Microtek focuses on optimum microelectronics packaging solutions from prototype to production for applications in: Die Attach, Die Sorting, Flip Chip, MEMS, MOEMS, VCSEL, Photonics, Ultrasonic, RFID..
Industry Directory | Consultant / Service Provider
Serving the Educational Needs of Modern Technologies
Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
Industry Directory | Manufacturer
ROBOTHERM is an engineering and manufacturing company specialized in the field of semiconductor, smart cards, C.O.B (Chip on Board), C.O.F (Chip on Flex), S.M.T (Surface Mounted Technology) and hybrids applications.
Industry Directory | Manufacturer
Micralyne offers a patented process for electroplating AuSn solder alloy, at compositions from 10 to 40 Sn (wt%), in patterned or unpatterned shapes onto metallized substrates at virtually any thickness.
