Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer
Ball Grid Array IC Reconditioning, Re-Ball Service, BGA IC Purchase and Resale
Industry Directory | Manufacturer
CVInc services advanced packaging. Placing solder bumps on single die, partial wafers, and complete wafers...we also offer RDL (redistribution) services in 5-7 working days. Our custom preforms are as small as 50um geometries.
Industry Directory | Manufacturer's Representative
ASE is contract IC assembly and test manufacturer situated in Penang Malaysia. Establishing wafer bumping capability is one of key program for year 2001 which I am given the task to start and establish. I am in search of any relevant technical papers, studies, technical bulletin to wafer bumping.
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
MeltroniX Inc provides advanced microelectronics packaging services to the elecvtronics sector. Processes include chip and wire, flip chip, wafer bumping, SMT, and complete hybrid/MCM fabrication.
Industry Directory | Consultant / Service Provider
Adhesive Flip Chip Technologies, Bumping Services (Pd, NiAu, polymer...), Assembly Services (Prototyping to High Volume)
Industry Directory | Manufacturer
Manufacturers of Automated Optical Inspection
STI is the leading manufactore of 2D/3D Automated visual defect inspection equipment. We offer the All-In-One soulution for inspecting Active Die, Probe Mark, Ink Dot & 2D/3D Bumped Wafers (including 300mm). .
