Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Distributor
Chip Quik, Inc. is the manufacturer of the patented Chip Quik SMD Removal Kit. With this unique product SMD's can be removed safely at low temperatures with a simple soldering iron or warm air. Chip Quik, Inc. also has a complete line of rework products.
Industry Directory | Manufacturer
Expertise and equipment to support the most intricate and challenging wire bonding applications. Fine wire wedge bonders, heavy wire bonders, ribbon bonders for backend semiconductor assembly.
Industry Directory | Manufacturer / Manufacturer's Representative
Sales/Marketing, Manufacturers Representatives, Used Equipment Sales
Eclipse Industries manufactures the ultra-high precision DS-107 Aligner Bonder, alignment to 1-2 microns, bond force 5 gm to 100 kg. Applications are flip chip, die bonding, CSP, uBGA, MCM, flat panel displays, die-to-wafer & optoelectronics.
Industry Directory | Manufacturer
Since 1980, the Dr. Tresky AG company has been supplying the micro- and opto- electronics industry with innovative component placers and die bonders.
Industry Directory | Consultant / Service Provider
Rhine USA Corp, DBA Rhine Labs Post Production Rework, IC Chip Programming, PCB Repair Service.
Provider of PCB Design, Fabrication, Assembly and Test Services. Burn-in Boards, Environmental Testing, BGA Rework & Xray services including Chio-On-Board and Flip Chip Assembly.
SMt BGA Rework and Repair Equipment including Split Vision processes and lead free soldered product rework application. Thru-Hole Desoldering and Plating Equipment.
Industry Directory | Manufacturer
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.
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