Eclipse Industries manufactures the ultra-high precision DS-107 Aligner Bonder, alignment to 1-2 microns, bond force 5 gm to 100 kg. Applications are flip chip, die bonding, CSP, uBGA, MCM, flat panel displays, die-to-wafer & optoelectronics.
Industry Directory | Manufacturer
IRC has been a leader in resistor technology, including the industry's comprehensive range of current sense resistors, precision discrete and networks, integrated passive components, and specialized power resistors.
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
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