Industry Directory | Manufacturer
Wafer Dicing, Die Attach, Wirebond, Glob Top, Semiconductor Packaging, RF Assemblies, SMT, PCB Assembly, Chip-on-Board, Multi-Chip Modules, Die Stacking, Flipchip, Stud Bumping, Prototyping, Process Development, Proof of Concept.
Industry Directory | Manufacturer
Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.
Amkor Technology is the world's largest independent supplier of outsourced packaging and test semiconductor interconnect services; with more than 33 years of continuous improvement, growth and innovation. http://www.amkor.com
Industry Directory | Manufacturer
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.
Industry Directory | Manufacturer
Promex is a broad technology Silicon Valley based EMS integrating SMT(consigned & full turnkey)with Chip-on-Substrate & Advanced Semiconductor Packaging. ISO 9001, ISO 13485 Medical & ITAR certified.
Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
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