Industry Directory | Manufacturer
Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.
Industry Directory | Manufacturer
Wafer Dicing, Die Attach, Wirebond, Glob Top, Semiconductor Packaging, RF Assemblies, SMT, PCB Assembly, Chip-on-Board, Multi-Chip Modules, Die Stacking, Flipchip, Stud Bumping, Prototyping, Process Development, Proof of Concept.
Eclipse Industries manufactures the ultra-high precision DS-107 Aligner Bonder, alignment to 1-2 microns, bond force 5 gm to 100 kg. Applications are flip chip, die bonding, CSP, uBGA, MCM, flat panel displays, die-to-wafer & optoelectronics.
EPI offers assembly services for very complex boards and specialized manufacturing capability to fulfill Bare Die Direct, Flip Chip and Multi-Chip-Module requirements. EPI also has all military certifications from the Defense Electronics Supply Comma
Industry Directory | Consultant / Service Provider / Manufacturer
Microtek focuses on optimum microelectronics packaging solutions from prototype to production for applications in: Die Attach, Die Sorting, Flip Chip, MEMS, MOEMS, VCSEL, Photonics, Ultrasonic, RFID..
Industry Directory | Consultant / Service Provider / Manufacturer
Tape Splicer for splicing SMD Carrier Tapes, including Paper and Pocket Tapes. SMD Splicing Tapes for 8mm - 24mm carrier tapes. Adhesive Back Die Carrier Tapes for Bare Dies and Flip Chips. SMT Carrier Tape Feeders.
Industry Directory | Manufacturer
CVInc services advanced packaging. Placing solder bumps on single die, partial wafers, and complete wafers...we also offer RDL (redistribution) services in 5-7 working days. Our custom preforms are as small as 50um geometries.
Industry Directory | Consultant / Service Provider / Manufacturer
Spectrum Integrity is a full service Engineering Design Service Firm. We are a Solution Provider for companies requiring outstanding hardware designs for advanced RF, High-Speed, and Semiconductor Test applications.
