Industry Directory: explosion solder-joint bga (Page 1 of 1)

Tianjin Reains Technologies Co., Ltd

Industry Directory | Manufacturer

Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.

Vision SMT Kft

Industry Directory | Manufacturer

Vision SMT is professional SMT house.PCBA including BGA,3D AOI inspection, X-ray inspection,selective soldering, in-line coating , testing.

Shuttle Star Technology Co., Ltd.

Industry Directory | Manufacturer

Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.

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