Global solutions for Electronics Manufacturing Services. 5 facilities featuring 17 Fuji & 16 Quad SMT lines, BGA & Micro BGA (Rework/2D X-ray), PTH, Flip Chip, COB, Prototype, ATE (Incircuit & Functional), Box Build, Fulfillment, DFM/DFT and Design.
Provider of PCB Design, Fabrication, Assembly and Test Services. Burn-in Boards, Environmental Testing, BGA Rework & Xray services including Chio-On-Board and Flip Chip Assembly.
Industry Directory | Manufacturer
CASE is a full service electronics contract manufacturer specializing in multi layer double sided surface mount, micro BGA's, flip chip, csp, and the highest of technology. A company built on customer service. New Englands most well equipped facility
Automated Assembly Corporation is a Contract Mfg. specializing in SMT-Flexible Circuits. Roll-to-Roll Assembly on Polyester, Polyimid, & PEN films. From Flip Chip on Polyester, to BGA. 24 Hr. Prototype, Low, Medium, High Volume. ISO-9001 Certified
Eclipse Industries manufactures the ultra-high precision DS-107 Aligner Bonder, alignment to 1-2 microns, bond force 5 gm to 100 kg. Applications are flip chip, die bonding, CSP, uBGA, MCM, flat panel displays, die-to-wafer & optoelectronics.
Industry Directory | Manufacturer
CASE is a full service electronics contract manufacturer specializing in multi layer double sided surface mount, micro BGA's, flip chip, csp, and the highest of technology. A company built on customer service. New Englands most well equipped electronics facility
Industry Directory | Manufacturer
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.
Industry Directory | Distributor / Manufacturer
An international distributor of mechanical IC samples or "dummy" components, SMD production tools and equipment
Industry Directory | Manufacturer's Representative
Manufacturing Representative serving North Carolina, South Carolina, and Virginia.
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