A free dedicated, neutral site for flip chip information, including technical articles, tutorials, technology updates, and qualified suppliers.
STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
Industry Directory | Manufacturer
Expertise and equipment to support the most intricate and challenging wire bonding applications. Fine wire wedge bonders, heavy wire bonders, ribbon bonders for backend semiconductor assembly.
Eclipse Industries manufactures the ultra-high precision DS-107 Aligner Bonder, alignment to 1-2 microns, bond force 5 gm to 100 kg. Applications are flip chip, die bonding, CSP, uBGA, MCM, flat panel displays, die-to-wafer & optoelectronics.
Industry Directory | Manufacturer / Manufacturer's Representative
Sales/Marketing, Manufacturers Representatives, Used Equipment Sales
Semiconductor Equipment Corporation designs and manufactures flip chip placement and
Industry Directory | Manufacturer
SMT,COB,FLIP CHIP,MCM Assembly. Prototype thru Production.
Industry Directory | Manufacturer
Vimic is expert in the design and manufacture of various types of fluid dispensing tools and a selection of Die Bonding Tools for customized applications. The offering includes Epoxy Stamping Tools, Pick-up Tools, Push up Needles.
MeltroniX Inc provides advanced microelectronics packaging services to the elecvtronics sector. Processes include chip and wire, flip chip, wafer bumping, SMT, and complete hybrid/MCM fabrication.
Industry Directory | Manufacturer's Representative
1-High layer count PCB manufacturer. 2-Flip chip plastic substrate manufacturer.
