A free dedicated, neutral site for flip chip information, including technical articles, tutorials, technology updates, and qualified suppliers.
STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
Semiconductor Equipment Corporation designs and manufactures flip chip placement and
Industry Directory | Manufacturer
SMT,COB,FLIP CHIP,MCM Assembly. Prototype thru Production.
MeltroniX Inc provides advanced microelectronics packaging services to the elecvtronics sector. Processes include chip and wire, flip chip, wafer bumping, SMT, and complete hybrid/MCM fabrication.
Industry Directory | Manufacturer's Representative
1-High layer count PCB manufacturer. 2-Flip chip plastic substrate manufacturer.
SMT Training programs , Hands-on Assembly line problem solving, yield improvement, consulting and process development. Flip Chip evaluation kits & Lab services
Industry Directory | Manufacturer
Ceramic and organic packaging and package assembly. Flip Chip, Wirebond, Lidding for a wide range of devices and applications from power semiconductors, ASICs, to complex modules.
Industry Directory | Consultant / Service Provider
Adhesive Flip Chip Technologies, Bumping Services (Pd, NiAu, polymer...), Assembly Services (Prototyping to High Volume)
EPI offers assembly services for very complex boards and specialized manufacturing capability to fulfill Bare Die Direct, Flip Chip and Multi-Chip-Module requirements. EPI also has all military certifications from the Defense Electronics Supply Comma
