Heat-activated, anti-static cover tapes for component packaging offer superior bond performance, resistivity and adhesive integrity. WAFERTAPE products for wafer mounting, dicing and backgrinding insure consistent, precise, repeatable wafer yields.
Industry Directory | Manufacturer
Sikama International designs, develops, manufactures and markets reflow solder furnaces/curing systems, featuring our patented conduction+convection heating and cooling technology. Our furnaces are designed for efficient use of power and gas.
Industry Directory | Manufacturer
GenRad provides electronics manufacturers and OEMs and their customers with software, hardware, test/inspection systems and services to optimize their design, manufacturing and after-market service productivity through increased yields and lower life cycle costs.
Industry Directory | Manufacturer
Teknek is the company that invented the contact-cleaning business. We have been helping manufacturers increase production yields, and reduce waste for over 30 years, saving customers an estimated $3bn.
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A worldwide leader in Automated Optical andx-ray Inspection systems
Industry Directory | Manufacturer
CYBEROPTICS is a global leader in high-precision 3D sensors that significantly improve yields and productivity in the 3D scanning and metrology, Surface Mount Technology & Semiconductor Markets
Industry Directory | Consultant / Service Provider / Manufacturer
Tape Splicer and Tape Splicing Products for splicing a seamless reel of SMD Components. Tape Splicing increases throughputs and yields by 15-20%. We also manufacture Antistatic Clean Room Lab Coats, Clean Room Coveralls, ESD Grounding Straps
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Nordson YESTECH is a leading global provider of automated optical inspection and high-resolution x-ray inspection systems.
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We manufacture evidence-based laser wire stripping solutions that automate processes to reduce scrappage and increase yield for our customers.
Industry Directory | Manufacturer
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.