Industry Directory | Consultant / Service Provider / Manufacturer
Microtek focuses on optimum microelectronics packaging solutions from prototype to production for applications in: Die Attach, Die Sorting, Flip Chip, MEMS, MOEMS, VCSEL, Photonics, Ultrasonic, RFID..
Industry Directory | Manufacturer
CoorsTek Gaiser invented the ceramic bonding tool. Our precision wire bonding tools include ceramic capillaries, wire wedges, ribbon wedges, ceramic/cermet wedges, die collets & vacuum pick-up tools.
Industry Directory | Manufacturer
Expertise and equipment to support the most intricate and challenging wire bonding applications. Fine wire wedge bonders, heavy wire bonders, ribbon bonders for backend semiconductor assembly.
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