NGA provides Micro Automation Dicing Saw Sales, Refurbishing, Service,Parts, Air Bearing Spindle rebuilding, Board stuffing and repair and Custom wafer dicing
Heat-activated, anti-static cover tapes for component packaging offer superior bond performance, resistivity and adhesive integrity. WAFERTAPE products for wafer mounting, dicing and backgrinding insure consistent, precise, repeatable wafer yields.
Industry Directory | Manufacturer
Majelac Technologies offers quick turn IC assembly services, including open cavity QFN, wafer dicing, die sorting, wire bonding, BGA reballing, BGA assy, prototype assembly, fine pitch wire bonding, and more,
Industry Directory | Manufacturer
Wafer Dicing, Die Attach, Wirebond, Glob Top, Semiconductor Packaging, RF Assemblies, SMT, PCB Assembly, Chip-on-Board, Multi-Chip Modules, Die Stacking, Flipchip, Stud Bumping, Prototyping, Process Development, Proof of Concept.
Industry Directory | Manufacturer / Other
Westwind Air Bearings is a world leader in air bearing spindle systems. Westwind technology has been successfully applied in: PCB drilling, semiconductor wafer grinding & dicing, ion implantation, coatings, disk writing, scanning & industrial.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Syagrus Systems specializes in high mix low volume SMD tape and reel packaging to support component distributors and OEM's. Our SMD tape and reel services exceed EIA standards with 100% inspection at lower costs then competitors.
Industry Directory | Manufacturer
Keteca USA manufactures dicing saw blades and dicing surfactants in its Arizona factory. We offer best performance and pricing and have much experience in ceramics, III-V materials and Si. quick turn arounds and USA made.
Industry Directory | Manufacturer
Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, g
Industry Directory | Equipment Dealer / Broker / Auctions
Trading of Used Electronics and Semiconductor Machines and Equipment
Optical polishing, edge polishing, dicing, flat lapping and machining of all hard materials including ceramic substrates, quartz, AlN, glass and sapphire windows, silicon wafers and very thin substrates and windows.
