Industry Directory | Manufacturer
a leading manufacturer of wafer handling tools for the global semiconductor industry. Our products include vacuum wands, wafer tweezers, HEPA vacuum pumps, etc. ESD safe products and tools for 300mm wafers are also available.
Industry Directory | Manufacturer
CVInc services advanced packaging. Placing solder bumps on single die, partial wafers, and complete wafers...we also offer RDL (redistribution) services in 5-7 working days. Our custom preforms are as small as 50um geometries.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Syagrus Systems specializes in high mix low volume SMD tape and reel packaging to support component distributors and OEM's. Our SMD tape and reel services exceed EIA standards with 100% inspection at lower costs then competitors.
Eclipse Industries manufactures the ultra-high precision DS-107 Aligner Bonder, alignment to 1-2 microns, bond force 5 gm to 100 kg. Applications are flip chip, die bonding, CSP, uBGA, MCM, flat panel displays, die-to-wafer & optoelectronics.
Industry Directory | Manufacturer
Wafer Dicing, Die Attach, Wirebond, Glob Top, Semiconductor Packaging, RF Assemblies, SMT, PCB Assembly, Chip-on-Board, Multi-Chip Modules, Die Stacking, Flipchip, Stud Bumping, Prototyping, Process Development, Proof of Concept.
STI is the leading manufactore of 2D/3D Automated visual defect inspection equipment. We offer the All-In-One soulution for inspecting Active Die, Probe Mark, Ink Dot & 2D/3D Bumped Wafers (including 300mm). .
Industry Directory | Manufacturer
Majelac Technologies offers quick turn IC assembly services, including open cavity QFN, wafer dicing, die sorting, wire bonding, BGA reballing, BGA assy, prototype assembly, fine pitch wire bonding, and more,
Industry Directory | Equipment Dealer / Broker / Auctions
Trading of Used Electronics and Semiconductor Machines and Equipment
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Manufacturer's Representative
Complete line of custom packaging materials and stock shipping supplies. Protective packaging, electronic component, ic tubes, anti static rubber bands, conductive corrugated boxes, bins, wafer packaging, foam, bags and boxes.
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
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