STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
Industry Directory | Manufacturer
Manufacturer of materials for the electronics assembly marketplace. Our RoHS-compliant products include solder pastes, fluxes, solder powder, core wire and bar solder and process support products.
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
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