Career Center - Jobs: bonding microelectronics (Page 1 of 1)

Wire/Die bond Engineer

Career Center | Milwaukee, Wisconsin USA | Engineering

Responsible for all Wire and die bond process within this fast growing Microelectronics company. Company is constantly upgrading equipment and processes to compete in the fiber optics arena. Company will either hire fulltime or a contract worker who

Excel Enterprises L.P.

SMT engineer

Career Center | , British Columbia Canada | Engineering

Looking for an engineer or technician to do some contract work on the assembly, testing, and failure of analysis of microelectronics packagages. The individual needs to understand the process of gold wire bonding and eutectic die attachment. Knowle

Oxford Global Resources

Mid-Atlantic Regional Sales Manager

Career Center | Philadelphia, New Jersey USA | Sales/Marketing

LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e

Electronics Search Group of MRI

Microelectronic Assembly Technician - Colorado

Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control

Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS

Ball Aerospace & Technologies Corp.

Eastern Region Technical Sales Manager

Career Center | Manchester, New Hampshire USA | Engineering,Sales/Marketing

We are currently seeking an experienced, energetic and motivated technical sales manager with hands on experience in the semiconductor packaging or microelectronics market. Responsibilities include: Manage all aspects of driving new sales oppo

Finetech

Lead Manufacturing Engineer

Career Center | Clifton, New Jersey USA | Engineering,Production

L3Harris is seeking an engineer to lead manufacturing and space vehicle integration related activities on the GPSIIIF and NTS3 program. The type of space flight hardware produced at this L3Harris location includes complex circuit card assemblies (CCA

L3 Communications, Telemetry and Instrumentation

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