Career Center - Jobs: esec die bonder (Page 1 of 1)

R&D technician

Career Center | San Jose, California USA | Research and Development

Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets.  You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag

Avago Technologies

Mid-Atlantic Regional Sales Manager

Career Center | Philadelphia, New Jersey USA | Sales/Marketing

LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e

Electronics Search Group of MRI

Senior Engineering Microassembler

Career Center | Brooklyn, New York USA | Engineering,Production

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications.  With design, sales and manufacturing locations in over 30 countries, Mini-Ci

Mini-Circuits

Product Manager

Career Center | Tewksbury, Massachusetts USA | Production,Purchasing

Mycronic is a global high-tech company whose innovative solutions have been advancing electronics technology for over 40 years. Today we continue to grow and serve customers in an expanding variety of industries. What we do impacts the future of tech

Mycronic Technologies AB

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esec die bonder searches for Companies, Equipment, Machines, Suppliers & Information

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Stencil Printing 101 Training Course
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Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
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