Career Center - Jobs: flip chip process (Page 1 of 3)

Process Engineer

Career Center | Greenville, South Carolina USA | Engineering

Process engineer with flip chip and die bonding experience is needed for a well-established company in South Carolina. This is a new position. Relocation is available. BS is required. Send resume as a Word attachment to sfrederick@connectipro.com.

Connecti*Pro

CSP/BGA Applications Engineer

Career Center | , | Engineering

A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment

Eden Associates

SMT Engineer

Career Center | , New Jersey USA | Engineering

Process Engineers SMT- Knowledge of all SMT lines. Flip Chip, BGA, experience. Skilled in Solder Paste, Pick and Place, Reflow and BGA rework equipment. Develop and analyze complex designs and develop specs and procedures

Circuit Search

Process Engineer and Technician

Career Center | , | 2001-05-16 15:58:28.0

Fast growing, well funded, manufacturer with leading edge technology seeks process development engineer or technician. Must have experience developing processes for new products. - adhesive dispensing - reflow - profiling - screen print - cleaning

R&D Process Engineering Manager

Career Center | , California USA | Engineering,Management,Production,Research and Development

Urgently looking for an Research & Development Process Engineering Manager. This expansion position has been created by continuous new business and the desire for my client to continue to be a leader in Process Engineering Development within the SMT

DCSI Consultants

R&D technician

Career Center | San Jose, California USA | Research and Development

Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets.  You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag

Avago Technologies

SMT Field Service Engineer

Career Center | Sunnyvale, California USA | Engineering

Our client is a leading equipment supplier to electronic assemblers around the world. Responsibilities: Conduct technical analysis of product implementations, modifications and enhancements to product in accordance with specific customer specifi

Greenline Group

Electronic Packaging Engineer

Career Center | Melbourne, Florida USA | Engineering,Research and Development

Harris Corporation (NYSE-HRS) is an international communications equipment company focused on providing product, system, and service solutions that take its customers to the next level. The company provides wireless, broadcast, government, and networ

Harris Corporation

Process and Product Support Engineers

Career Center | , New Jersey USA | Engineering

Several opportunities for skilled SMT Engineers and Product Support Engineers. Skilled in lean manufacturing and Kaizen. Skilled in working with BGA, Flip Chip and other related technologies. Skilled in new product introduction and line support acti

Circuit Search

Assembly Engineer - Electronics

Career Center | , South Carolina | Engineering

Assembly engineer with leadership capabilities needed for this position. Implement the proper controls to assure a reliable operation of the strap/inlay assembly, strap attach, and slitting processes. Actively pursue opportunities to continually imp

Connecti*Pro

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