Career Center | San Jose, California USA | Research and Development
Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets. You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: Experience in solid Edge CAD/CAM 3D system software and electronic packaging, Prior experience designing packaging systems a plus. Duties/Functions: Responsibility for the design of mechanical systems for electronic packaging. W
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