Career Center - Jobs: precision wafer dicing (Page 1 of 1)

Advanced Packaging Engineer

Career Center | San Jose, California USA | Engineering,Research and Development

Advanced Packaging Engineer � Develop advanced packaging technologies and processes, including: wafer thinning and dicing; die attach; wire bonding; overmolding; singulation � Perform Design of Experiments to establish optimized process windows for

F-O-R-T-U-N-E Personnel Consultants of Huntsville

Microelectronic Assembly Technician - Colorado

Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control

Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS

Ball Aerospace & Technologies Corp.

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precision wafer dicing searches for Companies, Equipment, Machines, Suppliers & Information

Precision PCB Services, Inc
Precision PCB Services, Inc

Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.

Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider

1750 Mitchell Ave.
Oroville, CA USA

Phone: (888) 406-2830

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