Career Center | Dallas, Texas USA | Engineering,Management
Skills/Requirements: Must have the ability to analyze data and recommend a course of action-prepare and make presentations-prepare reports-have working knowledge of Microsoft Excel-interact w/all levels of management. Duties/Functions: Establishes o
Career Center | Dallas, Texas USA | Engineering
Skills/requirments:BSEE or technical courses completed or equivalent, 5+years work experience, knowledge of all electrical parts (military and commercial) and have experience in electrical analysis and electrical testing of components. Strong commun
Career Center | Clarksburg, Maryland USA | Engineering,Production,Technical Support
Thales Communications, Inc. is currently seeking an SMT Solder Trainer for our Clarksburg, Maryland location. The primary responsibility of this position will be to organize and conduct our in-house SMT/Solder Training programs. Responsibilities
Career Center | EDEN PRAIRIE, Minnesota USA | Production
Logic PD collaborates with clients to help them launch products that accelerate growth and capture value in the Internet of Things (IoT). Logic PD helps at any stage in the product lifecycle by being the complete product innovation and product realiz
Career Center | Brooklyn, New York USA | Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | Lincoln, Nebraska USA | Engineering
Brief Description of Job Duties: Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and r
Career Center | Lincoln, Nebraska USA | Engineering
Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and reliability for both rigid and foi
| 1 |
