Career Center - Jobs: stencil vs pad design (Page 1 of 1)

PCBA New Product Introduction Engineer

Career Center | Auckland, New Zealand | Engineering

NAVMAN PCBA NPI Engineer Reporting To: PCBA NPI Technical Leader Primary Objective: Transition of PCBs from R&D design to a manufacturable state conforming to all facets of PCBA production Secondary: Develop DFM & best practice guidelines Res

Navman NZ LTD

Packaging Engineer

Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support

SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic

Texas Instruments

SMT Process Engineer

Career Center | Lincoln, Nebraska USA | Engineering

Brief Description of Job Duties: Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and r

Molex, Incorporated

SMT Process Engineer

Career Center | Lincoln, Nebraska USA | Engineering

Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and reliability for both rigid and foi

Molex, Incorporated

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Software for SMT placement & AOI - Free Download.
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Training online, at your facility, or at one of our worldwide training centers"