Career Center - Jobs: underfil (Page 1 of 1)

CSP/BGA Applications Engineer

Career Center | , | Engineering

A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment

Eden Associates

R&D technician

Career Center | San Jose, California USA | Research and Development

Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets.  You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag

Avago Technologies

SMT Process Engineer (Starlink)

Career Center | Hawthorne, California USA | Engineering

SMT PROCESS ENGINEER (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing

SpaceX

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underfil searches for Companies, Equipment, Machines, Suppliers & Information

SMT Machines

Training online, at your facility, or at one of our worldwide training centers"
Win Source Online Electronic parts

High Throughput Reflow Oven
2024 Eptac IPC Certification Training Schedule

World's Best Reflow Oven Customizable for Unique Applications
2024 Eptac IPC Certification Training Schedule

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...