Career Center - Jobs: underfill for bga (Page 1 of 1)

CSP/BGA Applications Engineer

Career Center | , | Engineering

A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment

Eden Associates

Representative for PCB Assembly

Career Center | Irvine, California USA | Sales/Marketing

We are a contract manufacturing company specializing in SMT, Thru-Hole and BGA assembly. Our niche is prototypes and medium volume. Visit our website at www.gmtechnical.com for our capital equipment listing and our capabilities. We are looking fo

1 GM Technical Services, Inc

Design for Test (DFT) / ATE Test Background

Career Center | San Jose, California USA | Engineering,Research and Development

www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som

SRQ Consultants LLC

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