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Career Center - Jobs: wafer dicing surfactant (Page 1 of 1)

Advanced Packaging Engineer

Career Center | San Jose, California USA | Engineering,Research and Development

Advanced Packaging Engineer � Develop advanced packaging technologies and processes, including: wafer thinning and dicing; die attach; wire bonding; overmolding; singulation � Perform Design of Experiments to establish optimized process windows for

F-O-R-T-U-N-E Personnel Consultants of Huntsville

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