Technical Library: /02 (Page 4 of 23)

在DPC陶瓷基板上如何做碳油厚膜电阻

Technical Library | 2023-05-23 02:37:23.0

在DPC陶瓷基板上如何做碳油厚膜电阻

Folysky Technology(Wuhan)Co.,Ltd

Choosing An Oscilloscope

Technical Library | 2016-10-07 12:50:02.0

15 points to consider when about to purchase a new oscilloscope

Saelig Co. Inc.

Evaluation Report Medium Temperature Dry Cabinet

Technical Library | 2024-02-07 18:49:35.0

Report of different drying temperatures

TOTECH Canada N.A Inc

Anti static IC shipping tube customization guidelines

Technical Library | 2019-02-07 02:24:06.0

Antistatic plastic IC shipping tube customization, need to provide the following four aspects of information: First, the choice of pipe material; Second, the size of the parts or physical; Third, the length of the pipe; Fourth, the choice of plug.

Shenzhen Sewate Technology Co.,Ltd

Wafer-Level Packaged MEMS Switch With TSV

Technical Library | 2012-02-02 19:09:53.0

A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (S

The Foundation for Scientific and Industrial Research - SINTEF

You, too, can do 0402!

Technical Library | 2005-05-16 12:09:02.0

Low cost techniques for building prototype and low volume SMT printed circuit boards.

Articulation LLC

A Study of Lead-Free Wave Soldering

Technical Library | 2007-05-02 15:00:17.0

This brief study of lead-free wave soldering focuses upon copper dissolution and solder maintenance issues. Unfortunately, it is determined that waste and changeover costs can dramatically increase with lead-free wave soldering.

AIM Solder

Multilayer PCB Stackup Planning

Technical Library | 2010-12-02 20:09:41.0

Planning the multilayer PCB stackup configuration is one of the most important aspects in achieving the best possible performance of a product. A correctly stacked PCB substrate ca effectively reduce electromagnetic emissions, crosstalk and also make the

In-Circuit Design Pty Ltd

0201 and 01005 Adoption in Industry

Technical Library | 2011-02-03 17:58:46.0

First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts for approximately 20% of surface mounted component (SMC) demand worldwide1. This pu

DfR Solutions

Ground Pours - To Pour Or Not To Pour?

Technical Library | 2011-02-17 18:03:21.0

Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias to ground. Usually, small isolated areas

In-Circuit Design Pty Ltd


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