Technical Library | 2004-09-02 11:56:32.0
The main goal of this paper is to highlight the importance of interrelating the physics and the chemistry in wave soldering and soft soldering in general. Often we find the disciplines of chemistry and physics being analyzed distinct and separate. However in the quest for alternative ways for leading edge competitive and especially environmental friendly manufacturing, separating or ignoring this interrelationship is detrimental to the success of No-Residue soldering.
Technical Library | 2009-02-13 12:29:39.0
To meet the market demand for a best-in-class, low-cost leadfree alloy for wave, selective and dip soldering
Technical Library | 2010-02-03 14:50:51.0
This paper will consider the unique characteristics of the renewable energy and clean-tech sectors and explore how a smartly optimized electronics manufacturing outsourcing model can help OEMs accelerate their timeto- market and support their cost-per-kilowatt reduction goals.
Technical Library | 2010-09-02 13:13:03.0
As chip packaging and interconnectivity have become more dense and operate at higher clock frequencies, physical access for traditional bed-of-nails testing becomes limited. This results in loss of ICT (in-circuit test) fault coverage and higher test fi
Technical Library | 2010-11-06 02:44:38.0
An increasing number of video equipment is running at Gigabit rates today. They are interconnected through relatively large size coaxial BNC connectors. While these connectors are in general of good quality, their performance in the equipment depends on
Technical Library | 2011-02-10 16:14:34.0
In this paper, we discuss an electromagnetics based approach to transmission line design, and then explore a novel printed transmission line, Periodic Micro Transmission Line (PMTL™, Patents Pending), with improved signal integrity to 40 GHz.
Technical Library | 2011-03-10 18:59:02.0
History shows that the electronics assembly industry is always up for a good challenge. This was proven with the successful move from through-hole to SMT assembly, the elimination of CFCs from the cleaning process and implementation of lead
Technical Library | 2011-06-02 15:49:09.0
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs, ADCs, and memory. They are susceptible to electrical, mechanical and thermal modes of failure like other components on a printed circuit boa
Technical Library | 2012-02-16 16:53:16.0
Channel simulations are only as accurate as the models used to develop them. While we have seen much effort placed on printed circuit board (PCB) materials (copper finish, dielectric moisture absorption), other elements within the channel have been largel
Technical Library | 2012-02-23 21:16:28.0
Installed for the first time 20 years ago, Automated Optical Inspection (AOI) more recently has become an essential part of our SMT environment. Today, most process engineers are turning to machines as an inspection strategy for addressing quality and pro
