Technical Library: /02 (Page 7 of 23)

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

Technical Library | 2009-02-13 12:29:39.0

To meet the market demand for a best-in-class, low-cost leadfree alloy for wave, selective and dip soldering

Kester

Optimizing the Clean-Tech Manufacturing Mix

Technical Library | 2010-02-03 14:50:51.0

This paper will consider the unique characteristics of the renewable energy and clean-tech sectors and explore how a smartly optimized electronics manufacturing outsourcing model can help OEMs accelerate their timeto- market and support their cost-per-kilowatt reduction goals.

OCM Manufacturing

Using JTAG Emulation for Board-Level Functional Test Demanding Test

Technical Library | 2010-09-02 13:13:03.0

As chip packaging and interconnectivity have become more dense and operate at higher clock frequencies, physical access for traditional bed-of-nails testing becomes limited. This results in loss of ICT (in-circuit test) fault coverage and higher test fi

Corelis Inc

Optimizing BNC PCB Footprint Designs for Digital Video Equipment

Technical Library | 2010-11-06 02:44:38.0

An increasing number of video equipment is running at Gigabit rates today. They are interconnected through relatively large size coaxial BNC connectors. While these connectors are in general of good quality, their performance in the equipment depends on

Samtec, Inc.

Novel Transmission Line for 40 GHz PCB Applications

Technical Library | 2011-02-10 16:14:34.0

In this paper, we discuss an electromagnetics based approach to transmission line design, and then explore a novel printed transmission line, Periodic Micro Transmission Line (PMTL™, Patents Pending), with improved signal integrity to 40 GHz.

Samtec, Inc.

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

Technical Library | 2011-03-10 18:59:02.0

History shows that the electronics assembly industry is always up for a good challenge. This was proven with the successful move from through-hole to SMT assembly, the elimination of CFCs from the cleaning process and implementation of lead

Henkel Electronic Materials

Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability

Technical Library | 2011-06-02 15:49:09.0

Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs, ADCs, and memory. They are susceptible to electrical, mechanical and thermal modes of failure like other components on a printed circuit boa

DfR Solutions

Connector Models - Are They Any Good?

Technical Library | 2012-02-16 16:53:16.0

Channel simulations are only as accurate as the models used to develop them. While we have seen much effort placed on printed circuit board (PCB) materials (copper finish, dielectric moisture absorption), other elements within the channel have been largel

Samtec, Inc.

What is really inside your AOI?

Technical Library | 2012-02-23 21:16:28.0

Installed for the first time 20 years ago, Automated Optical Inspection (AOI) more recently has become an essential part of our SMT environment. Today, most process engineers are turning to machines as an inspection strategy for addressing quality and pro

Vi TECHNOLOGY

An Investigation of Whisker Growth on Tin Coated Wire and Braid

Technical Library | 2012-08-02 21:05:14.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Pure tin is a common finish for copper hook up wire, coaxial cable, ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports o

Rockwell Collins


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