Technical Library: 04.0 (Page 1 of 4)

StencilQuick™ Lead-Free Solder Paste Rework Study

Technical Library | 2007-01-31 15:17:04.0

The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.

BEST Inc.

The Universal PCB Design Grid System

Technical Library | 2010-01-27 19:22:04.0

This paper reviews one of the single most important, but sometimes overlooked or taken for granted, aspects of the electronics industry – The PCB Design Grid System

Valor Computerised Systems Ltd

Technical Considerations for Controlling ESD in Electronics Manufacturing

Technical Library | 2011-08-18 19:12:04.0

Overview of ESD, Associated Risks and Prevention Measures

Microscan

Why Design PCB Assemblies with Testing in Mind?

Technical Library | 2017-11-14 15:30:04.0

Can you put a product that hasn't been fully tested on the market? When it comes to Printed Circuit Board (PCB) assembly and manufacturing, most firms’ answer is neither a strict yes or no.

Power Design Services

Possible reasons for simultaneous solder skip and short circuit of BGA

Technical Library | 2018-11-07 03:31:04.0

Generally speaking, there are not many cases of insufficient solder and solder short in BGA soldering, but it is not impossible. Here we discuss some elements may cause it

Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

Several ceramic materials are commonly used for the ceramic PCB

Technical Library | 2023-05-10 01:44:04.0

Several ceramic materials are commonly used for the ceramic PCB

Folysky Technology(Wuhan)Co.,Ltd

Molybdenum-Tips and Benefits for Laser Cutting

Technical Library | 2024-08-06 14:39:04.0

An article describing the process of laser cutting molybdenum with tips and benefits.

A-Laser, Inc.

Nike's Software Architecture and Infrastructure: Enabling Integrated Solutions for Gigahertz Designs

Technical Library | 1999-05-06 14:03:04.0

This paper describes how Nike’s innovative architecture addresses the expanding requirements of Intel’s next-generation processor designs while enabling a design environment that is more productive than one built with the previous tool generation.

Intel Corporation

Guidelines for Manufacturing Equipment Reference Manuals

Technical Library | 1999-08-05 09:31:04.0

This document provides suggested standard contents for equipment reference manuals for semiconductor process equipment. It includes a generic and detailed outline for equipment manuals, with major sections on installing, operating, controlling, and integrating process equipment.

SEMATECH

Management of your company's PLC automation risk.

Technical Library | 2012-06-01 00:14:04.0

PLCs are the brains of your operation. When the PLC (Programmable Logic Controllers) is not functioning properly, lines shut down, plants shutdown, even city bridges and water stations could cease to operate. Thousands to millions could be lost by one li

Business Industrial Network

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